Heatsink
Thermal Solutions International, Inc., headquarted in Simi Valley, CA is the premier designer and manufacturer of custom heatsinks and thermal solutions. With over 10,000 square feet of manufacturing area, TSI is ready and able to meet any of our customer's demands. Our products include a wide variety of standard and custom board level, BGA, DC/DC, high power, bonded fin, folded fin and microprocessor heatsinks. Our heatsinks are generally made from 6063 material but we can accommodate all types of metal requirements. We also carry a full line of heatsink extrusion profiles. We understand quick turn and excellent quality. That’s why at TSI we have a full machine shop in house to meet your every demand. We use state of the art Vertical and Horizontal CNC machines along with CNC Lathes to produce our products. We can machine almost anything imaginable. In addition, TSI has a trained quality staff on hand that utilizes our CMM (Coordinate Measuring Machine) and Optical Comparator to ensure that your parts meet your specifications every time. Equipment includes ten Kitamura Vertical CNC Machines, Wire EDM, Horizontal CNC Milling Machine, 60" Cutoff Saw, and two CNC Lathes. Machining is just the forefront of our operations. We also provide and integrate custom Thermal Interface Materials for all applications. Got a Plating requirement for your heatsink or other metal product as well? TSI has every plating process imaginable and all are certified to MIL Specification. We are your full service, quick turn heatsink manufacturer.
Thermal Interface Materials
At TSI, we believe in providing a complete thermal management solution to all of our customers. That's why we carry a full line of Thermal Interface Materials that we can integrate to your heatsink design. We offer products from leading manufacturers such as 3M, Chomerics, Laird Tech, Dow Corning, Bergquist, and Loctite. We also carry a full line of Thermal Compounds and Gap Filler Materials. In addition, we perform per piece die cutting for your custom heatsink application and can sell them independently of any heatsink order.
Bonded Fin & Folded Fin Heatsinks
Extruding aluminum is the most economical and widely used method of manufacturing heatsinks; however it has its limitations. That’s why at TSI we can manufacture custom Bonded Fin and Folded Fin Heatsinks.
Bonded Fin heatsinks use a stamped or pre-fabricated fin that is bonded into a channel located on a heatsink base plate using thermally conductive epoxy. Typically used in forced convection, these heatsinks can dissipate two to three times more heat than conventional extruded heatsinks by adding 200% to 300% to the cooling surface area. Fin density and height can be configured in countless combinations.
Folded Fin heatsinks use a continuous strip of aluminum or copper sheet metal affixed to an aluminum or copper base plate. The advantage of Folded Fin as opposed to extruded heatsinks is higher aspect ratios and thinner fins, thus increasing surface area and lowering thermal resistance. Fins can be manufactured as small as .006” thick. The fin stock is affixed to the base plate using either an epoxy or a brazing technique. Again, these heatsinks can be designed in numerous shapes and sizes.
DC/DC Converter Heatsinks
Thermal Solutions International, Inc. manufactures a wide array of DC/DC Converter Heatsinks. Our DC/DC Converter Heatsinks are optimized to effectively dissipate heat and increase converter reliability in a varied range of environments. Available in a variety of size, height and pin shape combinations, these heatsinks are cost-effective, high efficiency thermal solutions for a wide selection of dc/dc power modules.
BGA and Surface Mount Heatsinks
Thermal Solutions International, Inc. also specializes in low power surface mount and BGA (Ball Grid Array) Heatsinks. TSI offers a wide range of board level heat sinks for IC (Integrated Circuit) packages such as BGA and DIP packages and discrete power semiconductor packages. We carry heatsinks for the following JEDEC outlines…
Heat Spreaders
To effectively dissipate damaging heat from IC and discrete semiconductor chips we offer full machinability of heat spreaders. Heat spreader technology was developed to cool a concentrated area of high temperature and have that heat be distributed over a larger area, which in turn reduces the overall temperature of the chip.
Copper Heatsinks
While aluminum is the most prominently used material for heatsinks, copper is offered for extreme heat dissipation. With a thermal transfer rate almost double that of a comparable 6063 aluminum heatsink, a copper heatsink is an outstanding choice for spreading heat quickly from the heat source to the copper fins and into the surrounding air. TSI has copper bar stock on hand and can machine custom copper heatsinks to meet our customer’s requirements. We utilize our horizontal milling machine to quickly produce the parts and keep the cost down for you, our valued customer.
Custom Sheet Metal Housings
TSI's business model is primarily built around heatsinks but we consistently manufacture other products made from various types of metals. One of our other fields of expertise is in sheet metal production, forming, and punching. We often supply sheet metal housings and shrouds along with our heatsinks to customers in the RF Amplification, Motion Controller, and Digital Servo Amplifier markets. Protective coatings, finishes, hardware installation and silk-screening round out our sheet metal capability. We truly are your one stop shop for full custom heatsink and sheet metal housing integration.
Manufacturer/supplier's information
| Company name: | Thermal Solutions International, Inc. [ Homepage ] | |
| Business address: | 143 Nightwind Ln Simi Valley, CA 93065 USA |
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| Telephone number: | 805-277-9118 | |
| Fax number: | 805-277-7884 | |
| Contact name: | Anand Mandlay [ Email ] |
Product groups: Heatsink
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