Chip capacitor
Integrated circuits (ICs) are used widely for a variety of applications. An integrated circuit is commonly manufactured as a small die or chip of silicon material with many circuits etched onto the chip. The inputs and outputs to the circuits are typically routed to the edges of the chip and are connected to bonding pads which are linearly arranged around the perimeter of the chip. Advanced integrated circuits may include more than one million micro-electronic devices that are formed on a semiconductor substrate and cooperate to perform various functions within the IC. To achieve such dramatic increases in the density of circuit components has led to the scaling down of size of the circuit elements and the interconnection structures used to connect the circuit elements into functional circuitry, as well as scaling down the spacing between the interconnect. Generally, a multilayered chip capacitor (MLCC) has a structure such that internal electrodes are inserted between a plurality of dielectric layers. Such a chip capacitor has a small size and a high capacity, and is easily mounted, thus being widely used as a component of various electronic devices. Multilayer chip capacitors are used as capacitive components of high frequency circuits, particularly as decoupling capacitors arranged in power supply circuits of LSI (large scale integrated circuit). Multilayer ceramic chip capacitors form a multi-layered structure by alternating electrode layers and high dielectric constant-based ceramic layers. They are widely used as electronic parts featuring a small size and large capacitance. Tantalum chip capacitors have been widely used in a variety of applied circuits operated, with low rated voltages, in addition to a variety of industrial electronic equipments. Particularly, such tantalum chip capacitors have been preferably used in circuits, the operational performances of which are determined by their frequency characteristics. The terminals of a standard chip capacitor are comprised primary of surface conductors on opposite ends of the capacitor body. Each terminal may cover the end and may extend slightly around one or more edges towards the opposite terminal. When the chip type solid electrolytic capacitor is surface-mounted on a printed circuit board with the use of solder, a fillet made of the solder is formed between the printed circuit board and an end surface of a terminal of the chip type solid electrolytic capacitor.
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