Materials useful for packaging electronic components usually exhibit certain properties. For example, the packaging material should provide dissipation of static electricity and shielding from static discharges and electric fields that may be generated, e.g., when the electronic component moves inside the package or when the packaging material is rubbed against other materials. The packaging material should also function as a barrier against moisture vapor and oxygen to protect the electronic component from degradation while it is being stored. BGA (ball grid array) housing is a way of packaging electronic components. A commonly used format for electronic packages is known as the "quad flat pack" where the leads which are provided to connect a semiconductor device to the remainder of the system are provided on four sides of the semiconductor device and are formed to a gull-wing shape. A typical electronic device package assembly comprises a relatively flat lead frame having a plurality of leads terminating at an interior opening. The electronic device to be housed is positioned in alignment with the interior opening of the lead frame and is electrically attached to the interior terminal ends of the leads by connecting wires. The device for packaging electronic components in BGA housings has a mounting frame, which frames and retains a plastic intermediate substrate. The plastic intermediate substrate has a plurality of contact bumps with connected conductor tracks that lead to a plurality of semiconductor positions inside the associated mounting frame. Miniaturization of packaging is of continuing interest as electronic components become smaller and smaller. It is also a goal in the field of packaging designs to provide modularization so that various sized enclosures can be generated through the use of a minimum number of compatable mechanical components.
